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Design and Process Analysis of LED Heat Dissipation Substrate

Shenzhen Rigao Electronics Co.,Ltd | Updated: Jul 26, 2017

Design and Process Analysis of LED Heat Dissipation Substrate


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In the LED lighting industry, heat conduction and cooling problem is an important part of the current lighting design, it can be said that if the design process, heat conduction and cooling problems are not resolved, this product is likely to be a waste! Moreover, the heat conduction problem is not resolved, the radiator to do no big use. So, I am on the aluminum plate heat conduction to provide a way for your reference.


    Aluminum plate as a particularly important thermal material, in the wiring process has a special request. The following is the industry's most commonly used high-power LED to discuss the way to do with copper foil heat conduction.


    In the industry, the very popular way of wiring as follows:

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  LED heat generated by the same heat sink with the same copper foil surface conduction to the aluminum plate, section view is as follows:

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If so, the thermal path can be explained as follows:

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    LED heat sink ----- thermal grease ------- and the same heat sink copper foil ------ aluminum plate insulation layer ------ aluminum ------- heat sink


    It can be seen from the figure, LED to the aluminum plate thermal path and the heat sink only the same size.


    If we change the idea, the aluminum plate to do the following design, as shown below:

 We all know that the thermal conductivity of copper than the thermal conductivity of aluminum is much larger, we design, the LED heat sink pad with copper foil as much as possible to increase the heat of the LED heat sink in the copper foil layer fast Conduction to open, and then conduction to the underlying aluminum, artificially increase the thermal path, will greatly reduce the LED heat sink temperature, as much as possible to extend the working life of LED.


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